Treoプラットフォーム

Higher Performance and Accuracy

The Treo Platform provides elevated precision analog functionality with better transistor matching performance and higher speeds.

The advanced analog IP in Treo-based high performance ultrasonic sensors for example can improve accuracy by a factor of 2, improving overall safety and collision avoidance in park assist ADAS applications.

High Temperature System Robustness

The Treo Platform is designed from day one for automotive applications, being able to operate reliably at elevated temperatures: up to 175°C with models up to 200°C.

Being at least 25°C above alternate solutions, this capability in Treo-based products allows for higher heat dissipation on chip, improving overall system robustness and lowering the need for the additional circuitry needed to deal with higher ambient temperature.

Embedded Intelligence

Being built on a 65nm technology process, the Treo Platform can integrate high density digital allowing for products built on the platform to deliver advanced digital processing and local compute.

This provides system designers with new functionality such as flexible configuration and real-time positioning.

High Efficiency

Low Rsp of the Treo Platform enables more efficient power conversion. In addition, integration of analog and digital enables more compact power management solutions with advanced feature sets to improve overall power efficiency, extending battery life for low power device applications and lower total cost of ownership in AI Data Centers.