Terms of Use

This Site may contain forums, bulletin board services, chat areas, message boards, news feeds, news groups, communities, calendars, and/or other message or communication facilities designed to allow you to communicate with representatives of onsemi or with a group (collectively, “Communications Services”). You agree to use the Communication Services only to post, send, and receive messages and content that are considered proper and related to the particular Communication Service. Other than personally identifiable information, which is governed by onsemi's Privacy Policy, any information, material or communications you send to onsemi through this Site, including the Communication Services will be treated as non-confidential ("information"). For any information you do send, you hereby agree that onsemi is free to use any ideas, concepts, suggestions, know-how, techniques, and other information that you send to onsemi for any purpose without compensation. For any such non-confidential information you do send, and under any patent or copyright granted therefrom, you hereby grant and agree to grant onsemi an unrestricted, life-time, world-wide, royalty-free, right and license, with right to sublicense, to (1) make, have made, use, sell, offer for sale, import, and otherwise dispose of any product, and (2) use, disclose, reproduce, distribute, and make derivative works of the non-confidential information.

Among other actions, when using this Site and Communication Service, you agree that you will not post, send, submit, publish, or transmit in connection with this Site, or cause to be posted, sent, submitted, published or transmitted, any material that could give rise to any civil or criminal liability under the law, including without limitation, any material that:

1. you do not have the right to post, including without limitation any proprietary material of any third party protected by intellectual property laws (or by rights of privacy or publicity);
2. advocates or could reasonably serve to encourage, either directly or indirectly, any illegal or immoral activity, or discusses an intent to commit an illegal act or violate any law, rule, or regulation;
3. is vulgar, obscene, pornographic, incendiary, or indecent;
4. threatens or abuses others;
5. is libelous, defamatory towards others, racist, abusive, harassing, threatening or offensive;
6. seeks to exploit or harm children by exposing them to inappropriate content, or asking for personally identifiable details or information;
7. harvests or otherwise collects information about others, including e-mail addresses, financial information or other personally identifying information, without their prior express consent in each instance;
8. impersonates or misrepresents your connection to any other entity or person or otherwise manipulates or forges headers or identifiers to disguise the origin of content;
9. falsifies or deletes any author attributions, legal or other proper notices or proprietary designations or labels of the origin or source of software or other material contained in a file that is permissibly uploaded (e.g., copyright, trademark or patent notices);
10. advertises any commercial endeavor (e.g., offering for sale products or services) or otherwise engages in any commercial activity (e.g., conducting raffles or contests, displaying sponsorship banners, and/or soliciting goods or services) except as may be specifically authorized on this Site;
11. solicits funds, advertisers or sponsors for any purpose;
12. includes programs that contain viruses, worms and/or Trojan horses or any other computer code, files, or programs designed to interrupt, destroy, or limit the functionality of any computer software or hardware or telecommunications device;
13. disrupts the normal flow of dialogue, causes a screen to scroll faster than other users are able to type, or otherwise acts in a way which affects the ability of other people to engage in real-time activities via this Site;
14. amounts to a pyramid or other like scheme, including without limitation contests, chain letters, and surveys;
15. disobeys any policy or regulations including any code of conduct or other guidelines established from time to time regarding the use of this Site and/or any networks connected to this Site; or
16. contains hyperlinks to other sites that contain content that falls within the scope of this Section.

You acknowledge that any materials uploaded to the Communication Service may be subject to posted limits on use, reproduction, and/or dissemination, and you are responsible for abiding by such limitations with respect to your submissions, including any downloaded materials. Notwithstanding these rights, you remain solely responsible for the content of your submissions. You acknowledge and agree that neither onsemi nor any third party that provides Content to onsemi will assume or have any liability for any action made by onsemi or such third party with respect to any submission.

onsemi reserves the right at any time and from time to time to modify or discontinue, temporarily or permanently, the Communication Services (or any part thereof) with or without notice. You agree that this Site will not be liable to you or any third party for any modification, suspension, or discontinuance of the Communication Services.

WHILE onsemi EXPLICITLY PROHIBITS THE ABOVE CONDUCT, YOU ACKNOWLEDGE AND AGREE THAT YOU MAY BE EXPOSED TO SUCH CONDUCT AND CONTENT, AND THAT YOUR USE OF THIS SITE IS ENTIRELY AT YOUR OWN RISK, AND THAT THIS SITE SHALL HAVE NO LIABILITY OF ANY KIND FOR SUCH CONDUCT.

YOU UNDERSTAND AND AGREE THAT IF YOUR USE OF COMMUNICATIONS SERVICES VIOLATES ANY OF THE ABOVE CODES OF CONDUCT, onsemi CAN SUSPEND AND/OR TERMINATE YOUR USE OF THIS SITE IMMEDIATELY WITHOUT PRIOR NOTICE AND WITHOUT ANY RIGHT OF REFUND, SET-OFF, OR HEARING.

onsemi’s design tools software and Chat AI (collectively “Tools”) are intended to assist designers who are developing systems that incorporate onsemi products including by recreating the performance of circuits on a web-based tool or providing AI-generated answers to questions. onsemi makes no warranty on the use of these Tools and the use of the Tools does not expand the warranty offered by onsemi on its products which is found in the Terms of Sale. While onsemi will make every effort to keep all Tools accurate and up to date, the performance or functionality of an onsemi product in the real world may differ from any simulation performed on the Tools or any guidance provided by our Chat AI. onsemi reserves the right to change the Tools at any time. Any user of these Tools bears responsibility for testing the recommended onsemi products within their own systems, and the users are responsible for the safety and regulatory compliance of their systems. Use of the Tools is subject to these Terms and the Privacy Policy.

onsemi makes no representations whatsoever about any other website which you may access through this Site. When you access a non-onsemi website, please understand that it is independent from onsemi, and that onsemi has no control over the content on that website. In addition, a link to a non-onsemi website does not mean that onsemi endorses or accepts any responsibility for the content, or the use, of such website. It is up to you to take precautions to ensure that whatever you select for your use is free of such items as viruses, worms, trojan horses and other items of a destructive nature. onsemi makes no representation or warranty as to any third party products.

onsemi WILL NOT BE LIABLE FOR ANY DAMAGES OF ANY KIND ARISING OUT OF OR RELATING TO THE USE OR THE INABILITY TO USE THE COMMUNICATION SERVICES, THIS SITE, ITS CONTENT OR LINKS, INCLUDING, BUT NOT LIMITED TO, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES.

SOME JURISDICTIONS DO NOT ALLOW THE EXCLUSION OR LIMITATION OF INCIDENTAL OR CONSEQUENTIAL DAMAGES, SO THE ABOVE LIMITATION OR EXCLUSION MAY NOT APPLY TO YOU.

Buffalo, CDA, Ceff-PGA, Cheval, CMTL, Customer Defined Array, DECAL, DIMMIC, DSPRAM, E-POWER, FIRsT, FLEX Alphanumeric Chip, FLEX Chip, FLEX Numeric Chip, FLEX Stack, GEL-PAK, GlobalOptoisolator, GreenLine, HDC, H4C Series, H4C Plus, HYPERformance, MAACPAC, MCML, M·CORE, MECL 10K, MECL 10H, MECL III, Media Engine, Memorist, MicroCool, MicroSIMM, MONOMAX, MOSAIC I, MOSAIC II, MOSAIC III, MOSAIC IV, MOSAIC V, MUSCLE, Mustang, OACS, OnCE, PHACT, Power Manager, POWER OPTO, Predix, PRISMCard, QUIL, Senseon, µSIMM, SMARTMOS, SORF, Symmetric Superscalar, TestPAS, Thermopad II, TMOS V, VECOMP, VersaPower and X-ducer are trademarks of Motorola, Inc.

C-QUAM and MOSAIC are registered trademarks of Motorola, Inc.
Apollo is a registered trademark of Hewlett Packard Inc.
AutoLogic, NetEd, QuickSim II, QuickPath and Falcon Framework are trademarks of Mentor Graphics Corp.
ChipFET is a trademark of Vishay Siliconix.
Cho-Therm is a registered trademark of Chromerics, Inc.
Concept, Gate Ensemble, Verilog-XL, Veritime and Dracula are trademarks of Cadence Design Systems, Inc.
Daisy is a trademark of Daisy Systems Corporation. DDCMP and VAX are trademarks of Digital Equipment Corporation.
Design Compiler, HDL Compiler, Test Compiler and DesignWave are trademarks of Synopsys, Inc.
Echelon, LON, LONWORKS and NEURON are registered trademarks of Echelon Corporation.
ETHERNET is a trademark of Xerox Corporation.
FACT and FAST are trademarks of National Semiconductor Corporation.
FETKY is a registered trademark of International Rectifier Corporation.
Micro8 is a trademark of International Rectifier Corporation.
FIDE is a trademark of Aptronix. GED is a trademark of Valid Logic Systems Inc.
Grafoil is a registered trademark of Union Carbide.
HP/Apollo is a registered trademark of Hewlett-Packard Inc.
IBM, IBM PC, PowerPC and SDLC are trademarks of International Business Machines Corporation.
InterTools is a trademark of Intermetrics, Inc. Isotop is a trademark of SGS-Thomson Microelectronics.
Kapton and Teflon are registered trademarks of du Pont de Nemours & Co., Inc.
Kon-Dux and Rubber-Duc are Trademarks of Aavid Thermal Technologies, Inc.
LONBUILDER and LONTALK are trademarks of Echelon Corporation. Macintosh is a trademark of Apple Computer, Inc. Mentor Graphics is a trademark of Mentor Graphics Corporation.
MOTIVE is a registered trademark of Quad Design.
NeXT is a trademark of NeXT Computer, Inc.
Pentium is a registered trademark of Intel Corporation.
PowerFLEX is a trademark of Texas Instruments Incorporated.
POWERMITE and COOLPACK are registered trademarks of and used under a license from Microsemi Corporation.
ROM68K and SmartROM are trademarks of Integrated Systems, Inc.
Sil Pad is a trademark of the Bergquist Company.
SPARC is a trademark of SPARC International, Inc.
Sun-4 is a trademark of Sun Microsystems Inc.
Sync-Nut is a trademark of ITW Shakeproof.
Thermal Clad is a registered trademark of the Bergquist Company.
Thermasil is a registered trademark and Thermafilm is a trademark of Thermalloy, Inc.
UNIX is a registered trademark of X/Open Company, Ltd.
V2 is a trademark of Switch Power, Inc.
Virtex is a registered Trademark of Xilinx, Inc.
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology, Inc. and Motorola, Inc.