Image Sensors | MT9M114

CMOSイメージ・センサSystem-on-Chip、1 MP、1/6インチ

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Overview

ピクセル性能の向上にフォーカスするオン・セミコンダクターの技術により、このSOC（System-on-Chip）はコアに高品質イメージ・センサが内蔵されています。オン・セミコンダクターのSOCには、自動焦点、自動ホワイト・バランス、自動露出などさまざまなカメラ機能があります。SOCは費用効率の高いコンパクトなオンチップ・ソリューションで、イメージ品質が優れていて簡単に統合できるため、全体的なシステム・コストが下がりタイム・トゥ・マーケットが短縮されます。

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MT9M114EBLSTCZ-CR

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Active

CAD Model

Pb

A

H

P

ODCSP-55

570BP

3

260

CTRAY

3840

Y

CMOS

1.3

30

1/6 inch

Electronic Rolling

1.9 x 1.9

Parallel

RGB

-

Price N/A

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MT9M114EBLSTCZ-CR1

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Lifetime

CAD Model

Pb

A

H

P

ODCSP-55

570BP

3

260

CTRAY

480

N

CMOS

1.3

30

1/6 inch

Electronic Rolling

1.9 x 1.9

Parallel

RGB

-

Price N/A

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信頼性データ

Die Related Summary Data

Device: MT9M114EBLSTCZ-CR

Equivalent to wafer fab process: CIS 100is

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

CIS 100is

0

210102640

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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