IGBT/MOSFET Gate Drivers Optocouplers | FOD3125

高温、出力電流 2.5 A、ゲートドライブ・オプトカプラ

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Overview

FOD3125 は 2.5 A 出力電流ゲートドライブ・オプトカプラで、最高 125°C まで高温で中電力の IGBT/MOSFET を駆動することができます。モータ制御インバータ・アプリケーションや高性能電力システムに使用されるパワー IGBT/MOSFET の高速スイッチング駆動に最適です。 オン・セミコンダクターのコプラナ・パッケージング技術Optoplanar®と最適化されたIC設計を活用して高ノイズ耐量を実現、これは高コモン・モード除去という特性になります。 アルミニウム・ガリウムヒ素 (AlGaAs) 発光ダイオード (LED) が、プッシュプル MOSFET 出力段用高速ドライバ搭載集積回路に光学結合されています。

  • • Industrial Inverter• Uninterruptible Power Supply• Induction Heating• Isolated IGBT/Power MOSFET Gate Drive

  • Extended Industrial Temperate Range, -40°C to 125°C
  • High Noise Immunity Characterized by 35kV/µs Minimum Common Mode Rejection
  • 2.5 A Peak Output Current Driving Capability for Most 1200 V/20 A IGBT
  • Use of P-channel MOSFETs at Output Stage Enables Output Voltage Swing Close to The Supply Rail
  • Fast switching speed
  • Wide Supply Voltage Range from 15 V to 30 V
  • Fast Switching Speed
    – 400 ns max. Propagation Delay
    – 100 ns max. Pulse Width Distortion
  • Under-Voltage LockOut (UVLO) with hysteresis
  • Safety and Regulatory (Pending for Approval)
    – UL1577, 5000 VACRMS for 1 min.
    – DIN EN/IEC60747-5-5, 1,414 V Peak Working Insulation Voltage (VIORM)
  • RDS(ON) of 1 Ω (typ.) Offers Lower Power Dissipation
  • > 8.0 mm Clearance and Creepage Distance (Option ‘T’ or ‘TS’)

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

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IFLH (Max) (mA)

IDDL, IDDH (Max) (mA)

IOL, IOH (Min) (A)

tPHL, tPLH (Max) (ns)

PWD (Max) (ns)

VUVLO (Typ) (V)

VUVLO- (Typ) (V)

CMR (Min) (kV/µs)

VISO (Min) (V)

TOPR (Min) (°C)

TOPR (Max) (°C)

Reference Price

FOD3125

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Active

CAD Model

Pb

A

H

P

PDIP-8

646CQ

NA

0

BLKBG

1000

Y

5

3.8

2

400

100

12.7

11.2

35

5000

-40

125

$1.453

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FOD3125S

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CAD Model

Pb

A

H

P

PDIP-8 GW

709AC

1

260

BLKBG

1000

Y

5

3.8

2

400

100

12.7

11.2

35

5000

-40

125

$0.7679

More Details

FOD3125SD

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Active

CAD Model

Pb

A

H

P

PDIP-8 GW

709AC

1

260

REEL

1000

Y

5

3.8

2

400

100

12.7

11.2

35

5000

-40

125

$1.4881

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信頼性データ

Die Related Summary Data

Device: FOD3125

Equivalent to wafer fab process: BB,GA

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

BB,GA

0

58865369

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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