IGBTs | FGB40N60SM

IGBT、600V、40A、フィールド・ストップ

Obsolete

Datasheet

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Overview

当社の新シリーズのフィールドストップ第 2 世代 IGBT は、新しいフィールドストップ IGBT 技術を用いて、低い伝導損失およびスイッチング損失が必要不可欠な溶接機および PFC のアプリケーションに最適な性能を提供します。

  • その他の産業用

  • 最大接合部温度： TJ =175 °C
  • 簡単に並列操作するための正の温度係数
  • 高電流能力
  • 低飽和電圧: VCE(sat) =1.9V(通常) @IC=40A
  • 高速スイッチング: EOFF =6.5uJ/A
  • 厳格なパラメータ分布
  • RoHS対応
  • IRリフローのみ

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Product services, tools and other useful resources related to FGB40N60SM

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CAD Models

Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Family

V(BR)CES Typ (V)

IC Max (A)

VCE(sat) Typ (V)

VF Typ (V)

Eoff Typ (mJ)

Eon Typ (mJ)

Trr Typ (ns)

Irr Typ (A)

Gate Charge Typ (nC)

Short Circuit Withstand (µs)

EAS Typ (mJ)

PD Max (W)

Co-Packaged Diode

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FGB40N60SM

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Obsolete

Similar Products
CAD Model

Pb

A

H

P

D2PAK-3 / TO-263-2

418AJ

1

260

REEL

800

N

-

600

40

1.9

-

0.26

0.87

-

-

119

-

-

349

No

Price N/A

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信頼性データ

Die Related Summary Data

Device: FGB40N60SM

Equivalent to wafer fab process: IGBT

製品技術

製品技術

等価デバイス時間

MTBF/MTTF (時間)

FITS

IGBT

1

2930462991

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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